Hardcover: 576 pages
Publisher: McGraw-Hill Education; 6 edition (January 7, 2014)
Product Dimensions: 7.7 x 1.4 x 9.5 inches
Shipping Weight: 2.5 pounds (View shipping rates and policies)
Average Customer Review: 3.8 out of 5 stars See all reviews (4 customer reviews)
Best Sellers Rank: #395,273 in Books (See Top 100 in Books) #14 in Books > Engineering & Transportation > Engineering > Materials & Material Science > Extraction & Processing #55 in Books > Engineering & Transportation > Engineering > Electrical & Electronics > Circuits > Integrated #64 in Books > Engineering & Transportation > Engineering > Electrical & Electronics > Electronics > Semiconductors
This is a 6th edition but the updating is erratic. There are many sections where you will see the discussion of methods end with 0.35 micron processes. Yes, other sections go further, but it leaves you guessing about the usefulness of the information. There are also places where there are typos and diagrams with wrong labels that must have been there for a decade. I don't feel at all like I understand how a 22nm process works, or even 65 nm. For example the thinnest spin-on coating discussed is about 10x thicker than what I see discussed in research papers and you will not find any clue how that is achieved.As an introductory text it has the advantage of giving you an all-around view of how complicated the industry is. You will find discussions of everything from coating your shoes to coating high aspect contacts, from super pure chemicals to super-small self aligned processes. At the end of the book you probably know most of the processes in use.You will, however, probably not feel confident you have learned how the most modern chips are produced. This book requires a total overhaul if it is to remain relevant, now just tinkering.
This book is OK, but there are many typos and some wrong information in the book.
Almost through chapter 6. Great overview of the wafer fab process. Reads easily.
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