Hardcover: 576 pages
Publisher: McGraw-Hill Education; 1 edition (November 12, 2009)
Product Dimensions: 6.4 x 1.4 x 9.3 inches
Shipping Weight: 2 pounds (View shipping rates and policies)
Average Customer Review: 5.0 out of 5 stars See all reviews (1 customer review)
Best Sellers Rank: #1,769,413 in Books (See Top 100 in Books) #115 in Books > Engineering & Transportation > Engineering > Electrical & Electronics > Electronics > Optoelectronics #235 in Books > Science & Math > Physics > Nanostructures #475 in Books > Engineering & Transportation > Engineering > Electrical & Electronics > Electronics > Microelectronics
Advanced MEMS packaging is perhaps the most difficult technical challenge facing the electronics industry. It combines some of the still-unsolved riddles of 3D packaging with the difficulties of hermetic cavity packaging and the demands of non-electronic signal sensing.This 550-page book is an exhaustive examination of the current state of leading-edge MEMS packaging, the major directions that are being followed, and the research that might lead to solutions.It includes in-depth chapters on enabling technologies, with case studies. Eight following chapters cover detailed applications in Optical MEMS, Bio-MEMS, RF MEMS, and Accelerometers.In summary, this book offers a good mix of background, theory, practice, and projection. It should be a valuable aid for anyone associated with or considering advanced MEMS research, production, or use.
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