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Advances In 3D Integrated Circuits And Systems (Series On Emerging Technologies In Circuits And Systems)

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

File Size: 13741 KB

Print Length: 392 pages

Page Numbers Source ISBN: 9814699012

Publisher: WSPC; 1 edition (August 28, 2015)

Publication Date: September 10, 2015

Sold by:  Digital Services LLC

Language: English

ASIN: B0156GI1EE

Text-to-Speech: Enabled

X-Ray: Not Enabled

Word Wise: Not Enabled

Lending: Not Enabled

Enhanced Typesetting: Not Enabled

Best Sellers Rank: #2,012,588 Paid in Kindle Store (See Top 100 Paid in Kindle Store) #87 in Books > Engineering & Transportation > Engineering > Electrical & Electronics > Circuits > Logic #472 in Kindle Store > Kindle eBooks > Engineering & Transportation > Engineering > Electrical & Electronics > Circuits #532 in Books > Engineering & Transportation > Engineering > Electrical & Electronics > Circuits > Integrated

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